As AI models become larger and more capable, the spotlight has been on GPUs and semiconductors. But behind every breakthrough lies another critical challenge: how do we package, interconnect and cool increasingly powerful electronic systems?
This is where Mosaic comes in.
We are delighted to announce our investment in Mosaic Microsystems, a company pioneering an ultra-thin glass substrate platform for next-generation semiconductor packaging.
While largely invisible to end users, Mosaic’s technology has the potential to become a critical enabler for next-generation AI infrastructure, high-performance computing, advanced communications, aerospace & defence, photonics, sensing, and other high-performance electronic systems.
At In Group, we invest in foundational technologies that enable entire industries. Mosaic stood out for its differentiated technology, strong commercial traction, significant market opportunity, and an exceptional team with the expertise to execute.
We also believe innovation and sustainability can go hand in hand. By enabling thinner, higher-performance electronic architectures and more efficient semiconductor packaging, Mosaic’s platform has the potential to support the next generation of computing and communications infrastructure while making more efficient use of advanced materials.
Some of the most important technologies are the ones that quietly power the innovations everyone else sees.
We believe advanced semiconductor packaging is one of them, and that Mosaic Microsystems is well positioned to help shape its future.
